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EP21TDC-2AN, is a highly flexible, two component, thermally conductingepoxy resin compound for high performance bonding, coating, and encapsulation. The cured compound exhibits a 31% elongation, where the conductivity is 2.6 W/m•°K. As very little exotherm is developed during cure the resin is suitable for potting and encapsulation in very thick as well as thin sectioned configurations. This compound exhibits a tensile shear of over 7.37N/mm² together with a peel strength greater than15pli. It shows long term performance over a wide service temperaturerange of -185 to 120°C. Due to its flexibility, it is suited for bonding substrates with greatly
differing coefficients of expansion. The epoxy produces durable bonds to many different substrates includingmetals, glass, ceramics, wood, vulcanized rubber and many plastics. The hardened composition is a good electrical insulator with a volume resistivity of greater than 1012 ohm cm. Furthermore it offers thermalshock and chemical resistance including exposure to erosion from water, gasoline and numerous acids, bases and salts.
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